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Overbond FinTech Case Competition

Oct 28, 2016 - Oct 30, 2016

This event has ended. Please see our upcoming events page for more events.

Registration Closed
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Location: Ivey Business School

Team size: Four members per team - teams can be from Ivey HBA, MSc and MBA programs

Registration deadline: Friday, October 14th, 2016

Event details:

The Overbond FinTech Case Competition will be held virtually, with final in-person presentations on October 30th.  The competition will feature one case that focuses on the development of a business strategy for a company operating in the FinTech industry.  This case competition is an opportunity for students to apply lessons learned in class to a real-world context, while interacting with the team at Overbond and learning more about the fast growing FinTech industry.

All teams will receive participation certificates and there will be cash prizes for the top teams.  The winning team will also get an opportunity to have an exclusive networking session with the Overbond Executive team.


To register for this event, please create your four-member team and send team details to Shahmir Anjum at by 11:59pm on Friday, October 14th, 2016.  The following details will be required for each team member: member name, Ivey email address, telephone number, resume.

About Overbond:

Overbond is the first FinTech entrant into the primary bond issuance market, and operates an end-to-end platform and support framework for primary bond origination.  The fully digital Overbond platform for primary bond issuance provides higher transparency, better price discovery, and investor diversification for all counterparties in the primary bond market.  It is the first fully-integrated platform to connect bond market issuers, dealers, and fixed-income investors. 

For more information on Overbond, please visit Overbond's company website.